Direct Wafer Manufacturing
Our Wafers
A Better Class of Wafers at Half the Cost
The Direct Wafer process moves the silicon wafer from commodity to strategic advantage by introducing wafer properties unachievable with conventional technologies.
Lowest Carbon Footprint
High Performance
Any Wafer Size and Thickness
Double the Product
Per kg of Silicon
21st Century Solar Manufacturing
To make a wafer directly from molten silicon and skip ingot production, we invented a new furnace to replace the approaches that date back to the 1950s and 1970s.

The Czochralski furnace (mono) is an invention from Bell Labs in the 1950s that pulls a single silicon crystal into a massive, multi-stories-high boule that must be sawn to produce wafers.

The Direct Solidification Furnace (multi), invented in the 1970s, casts silicon into a 800+ kg ingot that must be sawn to produce wafers.

The Direct Wafer furnace produces silicon wafers directly from a molten bath, no sawing necessary. A 21st century invention for a 21st century industry.