Technology & Products

    Cubic’s technology portfolio provides the optimal solar solution for any market. It will underpin the next great wave of solar growth.

    Monocrystalline Wafers

    Cubic’s monocrystalline wafers, manufactured using industry-standard technology, meet the needs of today’s cell manufacturers. Cubic offers P-Type or N-Type M10 and G12 wafer products, optimized for specific cell architectures. Cubic’s mono wafer production is additionally advantaged by the Cubic team’s stand-alone competence in wafering equipment, hot zones, high temperature materials, process controls and equipment automation which contributes significantly to wafer quality.

    Tandem

    The future of solar energy

    CubicPV’s tandem modules will offer more than 30% greater efficiency than the highest efficiency conventional modules. It works by stacking two solar cells, made of different semiconductor materials, on top of each other. Silicon is the ideal material for the bottom cell in a tandem configuration. An extremely low cost silicon cell, powered by Direct Wafer technology, makes tandem economically viable for terrawatt scale. Perovskite, with its highly tunable properties and low CapEx, is the ideal top layer material. Together, the two materials will dramatically increase the power of every acre of solar deployed.

    Perovskite Technology

    A genuine breakthrough supported by the strongest patent portfolio in North America

    CubicPV’s perovskite technology is built to last. While interest in perovskite technology has surged given the material’s potential for high efficiency, low cost, and broad applicability in solar, a primary obstacle remains in the commercialization of perovskite solar technology: it’s durability. This is where CubicPV excels. We have tackled the durability issue through better chemistry. By building intrinsic stability into the material itself, we make it far more robust.

    Direct Wafer Manufacturing

    The bedrock for a tandem device and
    the key to ultra-low-cost solar.

    Direct Wafer technology eliminates the ingot and sawing steps from wafer production to produce a high-performance wafer directly from a bath of molten silicon. The resulting product produces the ideal bottom cell for high-efficiency tandem modules and offers a significant reduction in carbon footprint over conventional methods.